Some media had indicated that it was even valued the option to integrate a liquid cooling system in the Samsung Galaxy S7, in true Microsoft style. But it seems that this will ultimately not be the case. The truth is that this is logical, if you take into account both the design and the dimensions of the current Galaxy S6 -and that it is normal that they evolve in the new model that is expected for the month of February 2016-.
Passive dissipation, again the choice
This information has been known from the hand of one of Samsung’s engineers who in their Weibo profile has given several clues as to how the cooling system of its next high-end device will be improved (which, as it seems, the Samsung Galaxy S7 will have a variant with the Snapdragon 820 processor uploaded to increase its performance and therefore , with a higher heat emission when working). The fact is that from what has been known, they will again bet on the passive dissipation, but with some changes.
And what will these be? Well, from what seems like one of the most important in the Samsung Galaxy S7 would be the use of thermal paste inside the new model of the Koreans. In this way, and imitating the Xperia Z5 Premium, the heat would be reduced much more efficiently and, thus, forcing the Qualcomm processor and improving the “health” of the Exynos 8890 would be achieved without problems. In addition, the position and structure of the elements used in the cooling system would also be modified.
The fact is that this is a complicated task, we mean to improve dissipation, since it constantly increases the processor power and, generally, the spaces are reduced … which is not exactly positive (and, in addition, aluminum transfers heat quickly). The fact is that we are not going to say that this task is an art as indicated by the company’s engineer, but the truth is that the challenge with the Samsung Galaxy S7 is important.
The Snapdragon 820 does not give heat problems
Before concluding it is important to comment that the new Qualcomm processor, from what has been known, does not have the same overheating problems as the Snapdragon 810. Therefore, the advanced heat control that is needed for the Samsung Galaxy S7 It is due to increasing the frequency of the Snapdragon 820 (this variant, remember, will be the one that is put on sale in some regions, such as China and the US).
The fact is that it seems clear that the Samsung Galaxy S7 will have a much improved cooling system And this is good news since the only thing that can be obtained with this are positive things for the “health” of the terminal and, also, regarding manipulation at specific moments such as when playing.